功能简介：程序通过Technology文件转出准确的叠层和材料参数，生成XML控制文档，把GDS文件导入3D Layout或者SIwave中进行仿真，适用于2.5D/3D封装的Interposer仿真。 Readme: The program extract accurate stackup and material parameters from technology file, and generates XML control file, import GDS into 3D layout/SIwave to simulation, intend to 2.5d/3d package interposer simulation.
☆32Jul 17, 2025Updated 7 months ago
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